| Artikelbeschreibung | Backplane module interconnect, 1 SPM, 1 SCC, 5 pin-less sio / black fabric® electromagnetic coupling to every I/O slot / BLACK FABRIC®: Parallel, full duplex, redundant, hi-speed communication with 20 MB/S bandwidth at every I/O slot and up to 4 GB/S bandwidth. Isolation: 1200 V AC channel to channel, 1500 VAC channel to ground power consumption: 0 W max. power dissipation: 0 W max. tested per IEC 60068-2-27, IEC 60068-2-6, CISPR 11, IEC 61000-4-2 to IEC 61000-4-6, MIL-STD-461G, IEC/TS 61000-5-8:2009 |